Global Quad-Flat-No-Lead Packaging(QFN) Market Research Report 2021 - Impact of COVID-19 on the Market

Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB.Flat no-lead packages include an exposed thermal pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad.The QFN package is similar to the quad-flat package (QFP), and a ball grid array (BGA).
The Quad-Flat-No-Lead Packaging(QFN) market revenue was xx Million USD in 2016, grew to xx Million USD in 2021, and will reach xx Million USD in 2026, with a CAGR of xx during 2021-2026.

Considering the influence of COVID-19 on the global Quad-Flat-No-Lead Packaging(QFN) market, this report analyzed the impact from both global and regional perspectives. From production end to consumption end in regions such as North America, Europe, China, and Japan, the report put emphasis on analysis of market under COVID-19 and corresponding response policy in different regions.

This report also analyzes the strategies for different companies to deal with the impact of COVID-19 in detail to seek a path to recovery.

Under COVID-19 Outbreak, how the Quad-Flat-No-Lead Packaging(QFN) Industry will develop is also analyzed in detail in Chapter 1.8 of this report.

Major Players in Quad-Flat-No-Lead Packaging(QFN) market are:
Fujitsu Ltd
Amkor Technology
UTAC Group
STATS ChipPAC Pte. Ltd
ASE Industrial Holding, Co., Ltd.
Linear Technology Corporation
Microchip Technology Inc
NXP Semiconductor
Texas Instruments

Most important types of Quad-Flat-No-Lead Packaging(QFN) products covered in this report are:
Air-Cavity QFNs
Plastic Molded QFNs

Most widely used downstream fields of Quad-Flat-No-Lead Packaging(QFN) market covered in this report are:
Portable Devices
Radio Frequency (RF)
Wearable Devices
Others

Major Region

s or countries covered in this report:
North America
Europe
China
Japan
Middle East and Africa
South America
India
South Korea
Southeast Asia
Others

In Chapter 3.4, the report provides analysis of the reasons behind price fluctuations.

In chapters 5, 6, and 7, the impact of COVID-19 on the different regions in both production and consumption end and SWOT analysis are pointed out.

In Chapters 8, the report presents company's recent development and strategies to deal with the impact of COVID-19.

Years considered for this report:

Historical Years:

2016-2020

Base Year:

2020

Estimated Year:

2021

Forecast Period:

2021-2026