Global Polyimide Photosensitive Adhesive Film Market Research Report 2023

According to Researcher's new survey, global Polyimide Photosensitive Adhesive Film market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Polyimide Photosensitive Adhesive Film market research.

Key manufacturers engaged in the Polyimide Photosensitive Adhesive Film industry include MGC, I.S.T Corporation, CEN Electronic Material, NeXolve, DuPont, Kolon Industries, SKC, Toray Industries and Kaneka Corporation, etc. Among those manufacturers, the top 3 players guaranteed % supply worldwide in 2022.

For production bases, global Polyimide Photosensitive Adhesive Film production is dominated by and . The two regions contributed to % production share globally in 2022.

When refers to consumption region, % volume of Polyimide Photosensitive Adhesive Film were sold to North America, Europe and Asia Pacific in 2022. Moreover, China, plays a key role in the whole Polyimide Photosensitive Adhesive Film market and estimated to attract more attentions from industry insiders and investors.

Report Scope

This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Polyimide Photosensitive Adhesive Film market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.



By Company


MGC

I.S.T Corporation

CEN Electronic Material

NeXolve

DuPont

Kolon Industries

SKC

Toray Industries

Kaneka Corporation

SK Innovation

UBE

Taimide

Saint-Gobain

Arakawa Chem

Changchun Gao Qi Polyimide Material

Rayitek Hi-Tech Film

Shengyuan

Tianyuan

Changshu Huaqiang Insulating Materials

Jiangsu Yabao Insulation Material

Suzhou Kying Industrial Materials

Mingda Group

Yunda Electronic Materials

Tianhua Tech

Shanghai Qian Feng Insulating Material

Wuxi Gaotuo New Materials



Segment by Type


Thickness≤15μm

15μm
Thickness>25μm



Segment by Application


Electronics

Aerospace

Medical Care

Others


Production by Region



North America

Europe

China

Japan


Consumption by Region


North America

United States

Canada

Europe

Germany

France

U.K.

Italy

Russia

Asia-Pacific

China

Japan

South Korea

China Taiwan

Southeast Asia

India

Latin America, Middle East & Africa

Mexico

Brazil

Turkey

GCC Countries

The Polyimide Photosensitive Adhesive Film report covers below items:

Chapter 1: Product Basic Information (Definition, type and application)

Chapter 2: Manufacturers’ Competition Patterns

Chapter 3: Production Region Distribution and Analysis

Chapter 4: Country Level Sales Analysis

Chapter 5: Product Type Analysis

Chapter 6: Product Application Analysis

Chapter 7: Manufacturers’ Outline

Chapter 8: Industry Chain, Market Channel and Customer Analysis

Chapter 9: Market Opportunities and Challenges

Chapter 10: Market Conclusions

Chapter 11: Research Methodology and Data Source