Global Flip Chip Bonder Market Outlook 2021

Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made through conductive bumps placed on the surface of the die. The placing process amounts to the following:
1. Die is picked up and place on a "flipping device"
2. Die is "flipped" and moved to hover over the substrate (or board or carrier) where bumps reside - precisely positioned in their previously defined positions
3. The tool then places the die on the bump with a programmed amount of force
Flip chip bumping is a vital step to the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a "spacer" to prevent electrical shorts and provides mechanical support.
Flip chips avoid wire bonding and therefore are able to be much smaller than their counterparts. Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method.
The world leading enterprise in the Flip Chip Bonder market are Besi (NL), which followed by ASMPT (HK), Shibaura (JP), Muehlbauer (DE), K&S (US), Hanmi (KR), AMICRA (DE), SET (FR), and Athlete FA (JP). These Top companies currently account for more than 97% of the total market share.
From the perspective of product classification, Flip Chip Bonder has two categories: full-automatic and semi-automatic. In 2019, the full-automatic type accounts for about 76% of the total market share and occupies a dominant position in the product market.

Market Analysis and Insights: Global Flip Chip Bonder Market
The global Flip Chip Bonder market size is projected to reach US$ 308.7 million by 2026, from US$ 287.9 million in 2020, at a CAGR of 1.2% during 2021-2026.
This report focuses on Flip Chip Bonder volume and value at the global level, regional level and company level. From a global perspective, this report represents overall Flip Chip Bonder market size by analysing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, Japan, China, Southeast Asia, India, etc.

Global Flip Chip Bonder Market: Segment Analysis
The research report includes specific segments by region (country), by company, by Type and by Application. This study provides information about the sales and revenue during the historic and forecasted period of 2015 to 2026. Understanding the segments helps in identifying the importance of different factors that aid the market growth.


Segment by Type
Fully Automatic
Semi-Automatic


Segment by Application
IDMs
OSAT

Global Flip Chip Bonder Market: Regional Analysis
The report offers in-depth assessment of the growth and other aspects of the Flip Chip Bonder market in important regions, including the U.S., Canada, Germany, France, U.K., Italy, Russia, China, Japan, South Korea, Taiwan, Southeast Asia, Mexico, and Brazil, etc. Key regions covered in the report are North America, Europe, Asia-Pacific and Latin America.
The report has been curated after observing and studying various factors that determine regional growth such as economic, environmental, social, technological, and political status of the particular region. Analysts have studied the data of revenue, production, and manufacturers of each region. This section analyses region-wise revenue and volume for the forecast period of 2015 to 2026. These analyses will help the reader to understand the potential worth of investment in a particular region.

Global Flip Chip Bonder Market:

Competitive Landscape

This section of the report identifies various key manufacturers of the market. It helps the reader understand the strategies and collaborations that players are focusing on combat competition in the market. The comprehensive report provides a significant microscopic look at the market. The reader can identify the footprints of the manufacturers by knowing about the global revenue of manufacturers, the global price of manufacturers, and production by manufacturers during the forecast period of 2015 to 2019.
The major players in the market include BESI, ASMPT, Shibaura, Muehlbauer, K&S, Hamni, AMICRA Microtechnologies, SET, Athlete FA, etc.