Request SampleGlobal Display Driver Chip Packaging and Testing Market Research Report 2023
SKU ID : QYR-25892318 | Publishing Date : 05-Dec-2023 | No. of pages : 86
The semiconductor industry chain can be divided into three major links from top to bottom: design, manufacturing, and packaging and testing. Among them, packaging and testing is the last process in the manufacture of integrated circuit products. The process of packaging and testing wafers to obtain independent chips. Packaging and testing mainly includes two links of packaging and testing. Due to the relatively low added value of packaging and testing, high labor intensity, and relatively low entry barriers, the degree of localization of packaging and testing is relatively high. This report mainly studies the packaging and testing of display driver chips.
According to Researcher's new survey, global Display Driver Chip Packaging and Testing market is projected to reach US$ 4928.3 million in 2029, increasing from US$ 3176 million in 2022, with the CAGR of 6.8% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Display Driver Chip Packaging and Testing market research.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Display Driver Chip Packaging and Testing market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Steco(LG)
LB-Lusem(Samsung)
Chipbond Technology Corporation
IMOS-ChipMOS TECHNOLOGIES INC.
Hefei Chipmore Technology Co.,Ltd.
Union Semiconductor (Hefei) Co., Ltd.
Jiangsu Napace Semiconductor Co., Ltd.
Tongfu Microelectronics Co.,ltd.
JCET Group Co.,Ltd.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Hitech Semiconductor (Wuxi) Co., Ltd.
Hefei Chipmore Technology
Segment by Type
Chip Packaging
Chip Testing
Segment by Application
Communication
Consumer Electronics
Vehicle Electronics
Aerospace
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
The Display Driver Chip Packaging and Testing report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Global market size, regional market size. Market Opportunities and Challenges
Chapter 3: Companies’ Competition Patterns
Chapter 4: Product Type Analysis
Chapter 5: Product Application Analysis
Chapter 6 to 10: Country Level Value Analysis
Chapter 11: Companies’ Outline
Chapter 12: Market Conclusions
Chapter 13: Research Methodology and Data Source
According to Researcher's new survey, global Display Driver Chip Packaging and Testing market is projected to reach US$ 4928.3 million in 2029, increasing from US$ 3176 million in 2022, with the CAGR of 6.8% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Display Driver Chip Packaging and Testing market research.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Display Driver Chip Packaging and Testing market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Steco(LG)
LB-Lusem(Samsung)
Chipbond Technology Corporation
IMOS-ChipMOS TECHNOLOGIES INC.
Hefei Chipmore Technology Co.,Ltd.
Union Semiconductor (Hefei) Co., Ltd.
Jiangsu Napace Semiconductor Co., Ltd.
Tongfu Microelectronics Co.,ltd.
JCET Group Co.,Ltd.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Hitech Semiconductor (Wuxi) Co., Ltd.
Hefei Chipmore Technology
Segment by Type
Chip Packaging
Chip Testing
Segment by Application
Communication
Consumer Electronics
Vehicle Electronics
Aerospace
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
The Display Driver Chip Packaging and Testing report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Global market size, regional market size. Market Opportunities and Challenges
Chapter 3: Companies’ Competition Patterns
Chapter 4: Product Type Analysis
Chapter 5: Product Application Analysis
Chapter 6 to 10: Country Level Value Analysis
Chapter 11: Companies’ Outline
Chapter 12: Market Conclusions
Chapter 13: Research Methodology and Data Source
Frequently Asked Questions
This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.
- By product type
- By End User/Applications
- By Technology
- By Region
The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.
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