Global and Japan Wafer Grinder Market Insights, Forecast to 2027

Wafer Grinder uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentially. The robot is able to move a wafer from the wash station to either the measuring station for after-grinding measurements or directly to an output station. During grinding of one wafer, a second wafer may be held between the measuring station and the grind station while a ground wafer is moved from the wash station to the measuring station for after-grinding measurements.
In Asia-Pacific，Wafer Grinder key players include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, Beijing Dianke Electronic Equipment, etc. The top five manufacturers hold a share about 80%.
China Taiwan is the largest market, with a share over 25%, followed by South Korea, and Japan, both have a share over 45 percent.
In terms of product, Wafer Surface Grinder is the largest segment, with a share over 75%. And in terms of application, the largest application is Compound Semiconductors, followed by Silicon Wafer, etc.

Market Analysis and Insights: Global and Japan Wafer Grinder Market
This report focuses on global and Japan Wafer Grinder market.
In 2020, the global Wafer Grinder market size was US$ XX million and it is expected to reach US$ XX million by the end of 2027, with a CAGR of XX% during 2021-2027. In Japan the Wafer Grinder market size is expected to grow from US$ XX million in 2020 to US$ XX million by 2027, at a CAGR of XX% during the forecast period.

Global Wafer Grinder Scope and Market Size
Wafer Grinder market is segmented by region (country), players, by Type, and by Application. Players, stakeholders, and other participants in the global Wafer Grinder market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application in terms of revenue and forecast for the period 2016-2027.
For Japan market, this report focuses on the Wafer Grinder market size by players, by Type, and by Application, for the period 2016-2027. The key players include the global and local players which play important roles in Japan.


Segment by Type
Wafer Edge Grinder
Wafer Surface Grinder


Segment by Application
Silicon Wafer
Compound Semiconductors


By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE


By Company
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
Beijing Dianke Electronic Equipment
Koyo Machinery
Revasum
Daitron
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam