Global Silver Powder for Electronic Components Market Research Report 2023
SKU ID :QYR-25150456 | Published Date: 10-Oct-2023 | No. of pages: 107Description
Silver powder and silver flakes are white powders with metallic luster, with a face centered cubic structure. They are excellent conductors of heat and electricity. Silver powder and silver flakes are inert to most acids, but can quickly dissolve in dilute nitric acid and hot concentrated sulfuric acid. Silver powder and silver flakes are mainly used for manufacturing conductive paste, conductive coatings, conductive adhesives, etc. Silver powder for electronic components. Such as consumer electronics, communication equipment, automotive electronics, military industry, etc.
According to Researcher's new survey, global Silver Powder for Electronic Components market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Silver Powder for Electronic Components market research.
Key manufacturers engaged in the Silver Powder for Electronic Components industry include Ames Goldsmith, Johnson Matthey, Mitsui Kinzoku, Technic, Fukuda, Shoei Chemical, AG PRO Technology, MEPCO and Cermet Materials, Inc., etc. Among those manufacturers, the top 3 players guaranteed % supply worldwide in 2022.
For production bases, global Silver Powder for Electronic Components production is dominated by and . The two regions contributed to % production share globally in 2022.
When refers to consumption region, % volume of Silver Powder for Electronic Components were sold to North America, Europe and Asia Pacific in 2022. Moreover, China, plays a key role in the whole Silver Powder for Electronic Components market and estimated to attract more attentions from industry insiders and investors.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Silver Powder for Electronic Components market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Ames Goldsmith
Johnson Matthey
Mitsui Kinzoku
Technic
Fukuda
Shoei Chemical
AG PRO Technology
MEPCO
Cermet Materials, Inc.
TANAKA
Shin Nihon Kakin
Fenzi Group
Nanoshel
Tongling Nonferrous Metals Group Holding
Kunming Noble Metal Electronic Materials
Changgui Metal Powder
Hongwu International Group
Zhejiang Yamei Nano Technology
Beijing Deke Daojin Science and Technology
Segment by Type
Flake Silver Powder
Spherical Silver Powder
Segment by Application
Consumer Electronics
Communication Equipment
Automotive Electronics
Military Industry
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Silver Powder for Electronic Components report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
According to Researcher's new survey, global Silver Powder for Electronic Components market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Silver Powder for Electronic Components market research.
Key manufacturers engaged in the Silver Powder for Electronic Components industry include Ames Goldsmith, Johnson Matthey, Mitsui Kinzoku, Technic, Fukuda, Shoei Chemical, AG PRO Technology, MEPCO and Cermet Materials, Inc., etc. Among those manufacturers, the top 3 players guaranteed % supply worldwide in 2022.
For production bases, global Silver Powder for Electronic Components production is dominated by and . The two regions contributed to % production share globally in 2022.
When refers to consumption region, % volume of Silver Powder for Electronic Components were sold to North America, Europe and Asia Pacific in 2022. Moreover, China, plays a key role in the whole Silver Powder for Electronic Components market and estimated to attract more attentions from industry insiders and investors.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Silver Powder for Electronic Components market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Ames Goldsmith
Johnson Matthey
Mitsui Kinzoku
Technic
Fukuda
Shoei Chemical
AG PRO Technology
MEPCO
Cermet Materials, Inc.
TANAKA
Shin Nihon Kakin
Fenzi Group
Nanoshel
Tongling Nonferrous Metals Group Holding
Kunming Noble Metal Electronic Materials
Changgui Metal Powder
Hongwu International Group
Zhejiang Yamei Nano Technology
Beijing Deke Daojin Science and Technology
Segment by Type
Flake Silver Powder
Spherical Silver Powder
Segment by Application
Consumer Electronics
Communication Equipment
Automotive Electronics
Military Industry
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Silver Powder for Electronic Components report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
TOC
Tables & Figures
Companies
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