Global Silver Powder for Electronic Components Market Research Report 2023

SKU ID :QYR-25150456 | Published Date: 10-Oct-2023 | No. of pages: 107
Silver powder and silver flakes are white powders with metallic luster, with a face centered cubic structure. They are excellent conductors of heat and electricity. Silver powder and silver flakes are inert to most acids, but can quickly dissolve in dilute nitric acid and hot concentrated sulfuric acid. Silver powder and silver flakes are mainly used for manufacturing conductive paste, conductive coatings, conductive adhesives, etc. Silver powder for electronic components. Such as consumer electronics, communication equipment, automotive electronics, military industry, etc.

According to Researcher's new survey, global Silver Powder for Electronic Components market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Silver Powder for Electronic Components market research.

Key manufacturers engaged in the Silver Powder for Electronic Components industry include Ames Goldsmith, Johnson Matthey, Mitsui Kinzoku, Technic, Fukuda, Shoei Chemical, AG PRO Technology, MEPCO and Cermet Materials, Inc., etc. Among those manufacturers, the top 3 players guaranteed % supply worldwide in 2022.

For production bases, global Silver Powder for Electronic Components production is dominated by and . The two regions contributed to % production share globally in 2022.

When refers to consumption region, % volume of Silver Powder for Electronic Components were sold to North America, Europe and Asia Pacific in 2022. Moreover, China, plays a key role in the whole Silver Powder for Electronic Components market and estimated to attract more attentions from industry insiders and investors.

Report Scope

This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Silver Powder for Electronic Components market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.


By Company


Ames Goldsmith

Johnson Matthey

Mitsui Kinzoku

Technic

Fukuda

Shoei Chemical

AG PRO Technology

MEPCO

Cermet Materials, Inc.

TANAKA

Shin Nihon Kakin

Fenzi Group

Nanoshel

Tongling Nonferrous Metals Group Holding

Kunming Noble Metal Electronic Materials

Changgui Metal Powder

Hongwu International Group

Zhejiang Yamei Nano Technology

Beijing Deke Daojin Science and Technology


Segment by Type


Flake Silver Powder

Spherical Silver Powder


Segment by Application


Consumer Electronics

Communication Equipment

Automotive Electronics

Military Industry

Others


Production by Region



North America

Europe

China

Japan


Consumption by Region


North America

United States

Canada

Europe

Germany

France

U.K.

Italy

Russia

Asia-Pacific

China

Japan

South Korea

China Taiwan

Southeast Asia

India

Latin America, Middle East & Africa

Mexico

Brazil

Turkey

GCC Countries

The Silver Powder for Electronic Components report covers below items:

Chapter 1: Product Basic Information (Definition, type and application)

Chapter 2: Manufacturers’ Competition Patterns

Chapter 3: Production Region Distribution and Analysis

Chapter 4: Country Level Sales Analysis

Chapter 5: Product Type Analysis

Chapter 6: Product Application Analysis

Chapter 7: Manufacturers’ Outline

Chapter 8: Industry Chain, Market Channel and Customer Analysis

Chapter 9: Market Opportunities and Challenges

Chapter 10: Market Conclusions

Chapter 11: Research Methodology and Data Source

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