Electrostatic chuck, has been widely used in semiconductor process in plasma and vacuum environment, such as etching, chemical vapor deposition, ion implantation, etc. The advantages of this technology lie in its improvement of yield, no edge elimination effect of wafer, good wafer holding uniformity, controllable temperature, etc. A typical electrostatic chuck clamping system is a sandwich structure consisting of three parts: dielectric adsorption layer, electrode layer, and base layer. The three parts are stacked in the electrostatic chuck in a layered structure. From the surface to the base, they are dielectric adsorption layer, electrode layer, and base layer. Compared with traditional mechanical chuck and vacuum chuck, electrostatic chuck has many advantages. Therefore, electrostatic chuck has replaced the traditional mechanical chuck and vacuum chuck, and is widely used in integrated circuit manufacturing process. This report studies the semiconductor wafer electrostatic chuck for 300mm wafer.

According to Researcher's new survey, global Semiconductor Wafer Electrostatic Chucks for 300mm Wafer market is projected to reach US$ 1672.7 million in 2029, increasing from US$ 1165 million in 2022, with the CAGR of 5.3% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Semiconductor Wafer Electrostatic Chucks for 300mm Wafer market research.

Key manufacturers engaged in the Semiconductor Wafer Electrostatic Chucks for 300mm Wafer industry include Applied Materials, Lam Research, SHINKO, TOTO, Creative Technology Corporation, Kyocera, NGK Insulators, Ltd., NTK CERATEC and Tsukuba Seiko, etc. Among those manufacturers, the top 3 players guaranteed % supply worldwide in 2022.

For production bases, global Semiconductor Wafer Electrostatic Chucks for 300mm Wafer production is dominated by and . The two regions contributed to % production share globally in 2022.

When refers to consumption region, % volume of Semiconductor Wafer Electrostatic Chucks for 300mm Wafer were sold to North America, Europe and Asia Pacific in 2022. Moreover, China, plays a key role in the whole Semiconductor Wafer Electrostatic Chucks for 300mm Wafer market and estimated to attract more attentions from industry insiders and investors.

Report Scope

This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Semiconductor Wafer Electrostatic Chucks for 300mm Wafer market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.


By Company


Applied Materials

Lam Research

SHINKO

TOTO

Creative Technology Corporation

Kyocera

NGK Insulators, Ltd.

NTK CERATEC

Tsukuba Seiko

II-VI M Cubed


Segment by Type


Coulomb Type Electrostatic Chucks

Johnsen-Rahbek(JR) Type Electrostatic Chucks


Segment by Application


Wafer Supplier

Original Manufacturer of Semiconductor Equipment


Production by Region



North America

Europe

China

Japan

South Korea


Consumption by Region


North America

United States

Canada

Europe

Germany

France

U.K.

Italy

Russia

Asia-Pacific

China

Japan

South Korea

China Taiwan

Southeast Asia

India

Latin America, Middle East & Africa

Mexico

Brazil

Turkey

GCC Countries

The Semiconductor Wafer Electrostatic Chucks for 300mm Wafer report covers below items:

Chapter 1: Product Basic Information (Definition, type and application)

Chapter 2: Manufacturers’ Competition Patterns

Chapter 3: Production Region Distribution and Analysis

Chapter 4: Country Level Sales Analysis

Chapter 5: Product Type Analysis

Chapter 6: Product Application Analysis

Chapter 7: Manufacturers’ Outline

Chapter 8: Industry Chain, Market Channel and Customer Analysis

Chapter 9: Market Opportunities and Challenges

Chapter 10: Market Conclusions

Chapter 11: Research Methodology and Data Source