High Density Interconnects (HDI) board is defined as a board (PCB) with a higher wiring density per Unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<100 µm), smaller vias (<150 µm) and capture pads (<400 µm), I/O>300, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology. HDI board is used to reduce size and weight, as well as to enhance electrical performance.
Market Analysis and Insights: Global HDI Market
Due to the COVID-19 pandemic, the global HDI market size is estimated to be worth US$ 10460 million in 2022 and is forecast to a readjusted size of US$ 11370 million by 2028 with a CAGR of 1.4% during the forecast period 2022-2028. Fully considering the economic change by this health crisis, HDI PCB (1+N+1) accounting for % of the HDI global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While Consumer Electronics segment is altered to an % CAGR throughout this forecast period.
The sales revenue share of Unimicron is about 8%, which is the No.1 of the global HDI industry. The other competitors include Compeq, AT&S SEMCO, Ibiden, TTM, ZDT, Tripod, DAP, Unitech, Multek and LG Innotek, etc. China area is the biggest consumption area, accounting for 48% of the total consumption. As for downstream applications, Telecommunications is the largest application area, accounting for 61% of all demand.
Global HDI Market: Drivers and Restrains
The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2017 to 2028. This section mentions the volume of production by region from 2017 to 2028. Pricing analysis is included in the report according to each type from the year 2017 to 2028, manufacturer from 2017 to 2022, region from 2017 to 2022, and global price from 2017 to 2028.
A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.
Global HDI Market: Segment Analysis
The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2017 to 2028. by Application segment also provides consumption during the forecast period of 2017 to 2028. Understanding the segments helps in identifying the importance of different factors that aid the market growth.
Segment by Type
HDI PCB (1+N+1)
HDI PCB (2+N+2)
ELIC (Every Layer Interconnection)
Segment by Application
Consumer Electronics
Telecommunications
Computer & Display
Vehicle
Others
By Company
Unimicron
Compeq
AT&S
SEMCO
Ibiden
TTM
ZDT
Tripod
DAP
Unitech
Multek
LG Innotek
Young Poong (KCC)
Meiko
Daeduck
Production by Region
North America
Europe
South America
Japan
China
China Taiwan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina