The semiconductor industry chain can be divided into three major links from top to bottom: design, manufacturing, and packaging and testing. Among them, packaging and testing is the last process in the manufacture of integrated circuit products. The process of packaging and testing wafers to obtain independent chips. Packaging and testing mainly includes two links of packaging and testing. Due to the relatively low added value of packaging and testing, high labor intensity, and relatively low entry barriers, the degree of localization of packaging and testing is relatively high. This report mainly studies the packaging and testing of display driver chips.

According to Researcher's new survey, global Display Driver Chip Packaging and Testing market is projected to reach US$ 4928.3 million in 2029, increasing from US$ 3176 million in 2022, with the CAGR of 6.8% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Display Driver Chip Packaging and Testing market research.

The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

Report Scope

This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Display Driver Chip Packaging and Testing market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.


By Company


Steco(LG)

LB-Lusem(Samsung)

Chipbond Technology Corporation

IMOS-ChipMOS TECHNOLOGIES INC.

Hefei Chipmore Technology Co.,Ltd.

Union Semiconductor (Hefei) Co., Ltd.

Jiangsu Napace Semiconductor Co., Ltd.

Tongfu Microelectronics Co.,ltd.

JCET Group Co.,Ltd.

ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Hitech Semiconductor (Wuxi) Co., Ltd.

Hefei Chipmore Technology


Segment by Type


Chip Packaging

Chip Testing


Segment by Application


Communication

Consumer Electronics

Vehicle Electronics

Aerospace

Other

By Region

North America

United States

Canada

Europe

Germany

France

UK

Italy

Russia

Nordic Countries

Rest of Europe

Asia-Pacific

China

Japan

South Korea

Southeast Asia

India

Australia

Rest of Asia

Latin America

Mexico

Brazil

Rest of Latin America

Middle East & Africa

Turkey

Saudi Arabia

UAE

Rest of MEA

The Display Driver Chip Packaging and Testing report covers below items:

Chapter 1: Product Basic Information (Definition, Type and Application)

Chapter 2: Global market size, regional market size. Market Opportunities and Challenges

Chapter 3: Companies’ Competition Patterns

Chapter 4: Product Type Analysis

Chapter 5: Product Application Analysis

Chapter 6 to 10: Country Level Value Analysis

Chapter 11: Companies’ Outline

Chapter 12: Market Conclusions

Chapter 13: Research Methodology and Data Source