CMP Pad (Chemical Mechanical Polishing Pad) is a product which increases semiconductor integration by smoothening the semiconductor wafer surface through physical and chemical polishing processes.
CMP Pads market has several key players, like DuPont, Cabot, FUJIBO, and TWI Incorporated, with market share about 96% in value. Global giant manufactures mainly distributed in USA, Japan and Taiwan.
China Taiwan is the largest consumption region of CMP Pads in volume, with a consumption market share nearly 22% in 2019. The second place is South Korea; following China Taiwan with the consumption market share over 21% in 2019.

Market Analysis and Insights: Global CMP Pads Market
The global CMP Pads market is valued at US$ 776 million in 2019. The market size will reach US$ 1122.8 million by the end of 2026, growing at a CAGR of 5.8% during 2021-2026.

Global CMP Pads Scope and Segment
CMP Pads market is segmented by Type, and by Application. Players, stakeholders, and other participants in the global CMP Pads market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2016-2027.

Segment by Type
Hard CMP Pads
Soft CMP Pads

Segment by Application
300mm Wafer
200mm Wafer

By Company
DuPont
Cabot
FUJIBO
TWI Incorporated
JSR Micro
3M
FNS TECH
IVT Technologies
SKC
Hubei Dinglong

Production by Region
North America
Europe
China
Japan
South Korea
Taiwan, China

Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE