• Executive Summary o Market Overview • Market Landscape o Market ecosystem o Value chain analysis • Market Sizing o Market definition o Market segment analysis o Market size 2020 o Market outlook: Forecast for 2020 - 2025 • Five Forces Analysis o Five forces summary o Bargaining power of buyers o Bargaining power of suppliers o Threat of new entrants o Threat of substitutes o Threat of rivalry o Market condition • Market Segmentation by End-user o Market segments o Comparison by End-user o OSATs - Market size and forecast 2020-2025 o IDMs - Market size and forecast 2020-2025 o Market opportunity by End-user • Customer landscape o Customer landscape • Geographic Landscape o Geographic segmentation o Geographic comparison o APAC - Market size and forecast 2020-2025 o North America - Market size and forecast 2020-2025 o Europe - Market size and forecast 2020-2025 o South America - Market size and forecast 2020-2025 o MEA - Market size and forecast 2020-2025 o Key leading countries o Market opportunity by geography o Market drivers o Market challenges o Market trends • Vendor Landscape o Overview o Landscape disruption • Vendor Analysis o Vendors covered o Market positioning of vendors o ASM Pacific Technology Ltd. o BE Semiconductor Industries NV o DIAS Automation (HK) Ltd. o Dr. Tresky AG o Finetech GmbH & Co. KG o Kulicke and Soffa Industries Inc. o Mycronic AB o Palomar Technologies Inc. o SHINKAWA Ltd. o West·Bond Inc. • Appendix o Scope of the report o Currency conversion rates for US$ o Research methodology o List of abbreviations Exhibit • 1: Key Finding 1 • 2: Key Finding 2 • 3: Key Finding 3 • 4: Key Finding 5 • 5: Key Finding 6 • 6: Key Finding 7 • 7: Key Finding 8 • 8: Parent market • 9: Market characteristics • 10: Offerings of vendors included in the market definition • 11: Market segments • 12: Global - Market size and forecast 2020 - 2025 ($ million) • 13: Global market: Year-over-year growth 2020 - 2025 (%) • 14: Five forces analysis 2020 & 2025 • 15: Bargaining power of buyers • 16: Bargaining power of suppliers • 17: Threat of new entrants • 18: Threat of substitutes • 19: Threat of rivalry • 20: Market condition - Five forces 2020 • 21: End user - Market share 2020-2025 (%) • 22: Comparison by End user • 23: OSATs - Market size and forecast 2020-2025 ($ million) • 24: OSATs - Year-over-year growth 2020-2025 (%) • 25: IDMs - Market size and forecast 2020-2025 ($ million) • 26: IDMs - Year-over-year growth 2020-2025 (%) • 27: Market opportunity by End user • 28: Customer landscape • 29: Market share by geography 2020-2025 (%) • 30: Geographic comparison • 31: APAC - Market size and forecast 2020-2025 ($ million) • 32: APAC - Year-over-year growth 2020-2025 (%) • 33: North America - Market size and forecast 2020-2025 ($ million) • 34: North America - Year-over-year growth 2020-2025 (%) • 35: Europe - Market size and forecast 2020-2025 ($ million) • 36: Europe - Year-over-year growth 2020-2025 (%) • 37: South America - Market size and forecast 2020-2025 ($ million) • 38: South America - Year-over-year growth 2020-2025 (%) • 39: MEA - Market size and forecast 2020-2025 ($ million) • 40: MEA - Year-over-year growth 2020-2025 (%) • 41: Key leading countries • 42: Market opportunity by geography ($ million) • 43: Impact of drivers and challenges • 44: Vendor landscape • 45: Landscape disruption • 46: Industry risks • 47: Vendors covered • 48: Market positioning of vendors • 49: ASM Pacific Technology Ltd. - Overview • 50: ASM Pacific Technology Ltd. - Business segments • 51: ASM Pacific Technology Ltd. - Key offerings • 52: ASM Pacific Technology Ltd. - Key customers • 53: ASM Pacific Technology Ltd. - Segment focus • 54: BE Semiconductor Industries NV - Overview • 55: BE Semiconductor Industries NV - Business segments • 56: BE Semiconductor Industries NV - Key offerings • 57: BE Semiconductor Industries NV - Key customers • 58: BE Semiconductor Industries NV - Segment focus • 59: DIAS Automation (HK) Ltd. - Overview • 60: DIAS Automation (HK) Ltd. - Product and service • 61: DIAS Automation (HK) Ltd. - Key offerings • 62: DIAS Automation (HK) Ltd. - Key customers • 63: DIAS Automation (HK) Ltd. - Segment focus • 64: Dr. Tresky AG - Overview • 65: Dr. Tresky AG - Product and service • 66: Dr. Tresky AG - Key offerings • 67: Dr. Tresky AG - Key customers • 68: Dr. Tresky AG - Segment focus • 69: Finetech GmbH & Co. KG - Overview • 70: Finetech GmbH & Co. KG - Product and service • 71: Finetech GmbH & Co. KG - Key offerings • 72: Finetech GmbH & Co. KG - Key customers • 73: Finetech GmbH & Co. KG - Segment focus • 74: Kulicke and Soffa Industries Inc. - Overview • 75: Kulicke and Soffa Industries Inc. - Business segments • 76: Kulicke and Soffa Industries Inc. - Key offerings • 77: Kulicke and Soffa Industries Inc. - Key customers • 78: Kulicke and Soffa Industries Inc. - Segment focus • 79: Mycronic AB - Overview • 80: Mycronic AB - Business segments • 81: Mycronic AB - Key offerings • 82: Mycronic AB - Key customers • 83: Mycronic AB - Segment focus • 84: Palomar Technologies Inc. - Overview • 85: Palomar Technologies Inc. - Product and service • 86: Palomar Technologies Inc. - Key offerings • 87: Palomar Technologies Inc. - Key customers • 88: Palomar Technologies Inc. - Segment focus • 89: SHINKAWA Ltd. - Overview • 90: SHINKAWA Ltd. - Product and service • 91: SHINKAWA Ltd. - Key offerings • 92: SHINKAWA Ltd. - Key customers • 93: SHINKAWA Ltd. - Segment focus • 94: West·Bond Inc. - Overview • 95: West·Bond Inc. - Product and service • 96: West·Bond Inc. - Key offerings • 97: West·Bond Inc. - Key customers • 98: West·Bond Inc. - Segment focus • 99: Currency conversion rates for US$ • 100: Research Methodology • 101: Validation techniques employed for market sizing • 102: Information sources • 103: List of abbreviations

ASM Pacific Technology Ltd., BE Semiconductor Industries NV, DIAS Automation (HK) Ltd., Dr. Tresky AG, Finetech GmbH & Co. KG, Kulicke and Soffa Industries Inc., Mycronic AB, Palomar Technologies Inc., SHINKAWA Ltd., West·Bond Inc.