•Executive Summary o Market Overview •Market Landscape o Market ecosystem o Value chain analysis •Market Sizing o Market definition o Market segment analysis o Market size 2019 o Market outlook: Forecast for 2019 - 2024 •Five Forces Analysis o Bargaining power of buyers o Bargaining power of suppliers o Threat of new entrants o Threat of substitutes o Threat of rivalry o Market condition •Market Segmentation by Product o Market segments o Comparison by Product o PCB connectors - Market size and forecast 2019-2024 o I/O rectangular - Market size and forecast 2019-2024 o Application-specific - Market size and forecast 2019-2024 o Others - Market size and forecast 2019-2024 o Market opportunity by Product •Market Segmentation by Application o Market segments o Comparison by Application o Automotive - Market size and forecast 2019-2024 o IT - Market size and forecast 2019-2024 o Telecom/datacom - Market size and forecast 2019-2024 o Others - Market size and forecast 2019-2024 o Market opportunity by Application •Customer landscape o Overview •Geographic Landscape o Geographic segmentation o Geographic comparison o APAC - Market size and forecast 2019-2024 o Europe - Market size and forecast 2019-2024 o North America - Market size and forecast 2019-2024 o South America - Market size and forecast 2019-2024 o MEA - Market size and forecast 2019-2024 o Key leading countries o Market opportunity by geography •Drivers, Challenges, and Trends o Market drivers o Volume driver - Demand led growth o Volume driver - Supply led growth o Volume driver - External factors o Volume driver - Demand shift in adjacent markets o Price driver - Inflation o Price driver - Shift from lower to higher-priced units o Market challenges o Market trends •Vendor Landscape o Overview o Landscape disruption •Vendor Analysis o Vendors covered o Market positioning of vendors o 3M Co. o ABB Ltd. o Amphenol Corp. o Aptiv Plc o Foxconn Interconnect Technology Ltd. o Huawei Technologies Co. Ltd o METZ CONNECT GmbH o Rosenberger Hochfrequenztechnik GmbH & Co. KG o TE Connectivity Ltd. o Yazaki Corp. •Appendix o Scope of the report o Currency conversion rates for US$ o Research methodology o List of abbreviations •1.Key Finding 1 •2.Key Finding 2 •3.Key Finding 3 •4.Key Finding 5 •5.Key Finding 6 •6.Key Finding 7 •7.Key Finding 8 •8.Key Finding 9 •9.Market in focus •11.Parent market •14.Market characteristics •16.Offerings of vendors included in the market definition •18.Market segments •23.Global - Market size and forecast 2019 - 2024 ($ billion) •24.Global market: Year-over-year growth 2019 - 2024 (%) •25.Five forces analysis 2019 & 2024 •28.Bargaining power of buyers •30.Bargaining power of suppliers •31.Threat of new entrants •32.Threat of substitutes •34.Threat of rivalry •36.Market condition - Five forces 2019 •38.Product placement - Market share 2019-2024 (%) •39.Comparison by Product •42.PCB connectors - Market size and forecast 2019-2024 ($ billion) •43.PCB connectors - Year-over-year growth 2019-2024 (%) •46.I/O rectangular - Market size and forecast 2019-2024 ($ billion) •47.I/O rectangular - Year-over-year growth 2019-2024 (%) •50.Application-specific - Market size and forecast 2019-2024 ($ billion) •51.Application-specific - Year-over-year growth 2019-2024 (%) •54.Others - Market size and forecast 2019-2024 ($ billion) •55.Others - Year-over-year growth 2019-2024 (%) •57. Market opportunity by Product •59.Application placement - Market share 2019-2024 (%) •60.Comparison by Application •63.Automotive - Market size and forecast 2019-2024 ($ billion) •64.Automotive - Year-over-year growth 2019-2024 (%) •67.IT - Market size and forecast 2019-2024 ($ billion) •68.IT - Year-over-year growth 2019-2024 (%) •71.Telecom/datacom - Market size and forecast 2019-2024 ($ billion) •72.Telecom/datacom - Year-over-year growth 2019-2024 (%) •75.Others - Market size and forecast 2019-2024 ($ billion) •76.Others - Year-over-year growth 2019-2024 (%) •77. •78. Market opportunity by Application •79.Customer landscape •81.Market share by geography 2019-2024 (%) •82.Geographic comparison •85.APAC - Market size and forecast 2019-2024 ($ billion) •87.APAC - Year-over-year growth 2019-2024 (%) •90.Europe - Market size and forecast 2019-2024 ($ billion) •92.Europe - Year-over-year growth 2019-2024 (%) •95.North America - Market size and forecast 2019-2024 ($ billion) •97.North America - Year-over-year growth 2019-2024 (%) •100.South America - Market size and forecast 2019-2024 ($ billion) •102.South America - Year-over-year growth 2019-2024 (%) •105.MEA - Market size and forecast 2019-2024 ($ billion) •107.MEA - Year-over-year growth 2019-2024 (%) •109.Key leading countries •111.Market opportunity by geography ($ billion) •112.Impact of drivers and challenges •113.Vendor landscape •115.Landscape disruption •117.Industry risks •120.Vendors covered •122.Market positioning of vendors •124.3M Co. - Overview •125.3M Co. - Business segments •126.3M Co. - Key offerings •127.3M Co. - Key customers •128.3M Co. - Segment focus •130.ABB Ltd. - Overview •131.ABB Ltd. - Business segments •132.ABB Ltd. - Key offerings •133.ABB Ltd. - Key customers •134.ABB Ltd. - Segment focus •135. •136.Amphenol Corp. - Overview •137.Amphenol Corp. - Business segments •138.Amphenol Corp. - Key offerings •139.Amphenol Corp. - Key customers •140.Amphenol Corp. - Segment focus •142.Aptiv Plc - Overview •143.Aptiv Plc - Business segments •144.Aptiv Plc - Key offerings •145.Aptiv Plc - Key customers •146.Aptiv Plc - Segment focus •148.Foxconn Interconnect Technology Ltd. - Overview •149.Foxconn Interconnect Technology Ltd. - Product and service •150.Foxconn Interconnect Technology Ltd. - Key offerings •151.Foxconn Interconnect Technology Ltd. - Key customers •152.Foxconn Interconnect Technology Ltd. - Segment focus •154.Huawei Technologies Co. Ltd - Overview •155.Huawei Technologies Co. Ltd - Business segments •156.Huawei Technologies Co. Ltd - Key offerings •157.Huawei Technologies Co. Ltd - Key customers •158.Huawei Technologies Co. Ltd - Segment focus •160.METZ CONNECT GmbH - Overview •161.METZ CONNECT GmbH - Product and service •162.METZ CONNECT GmbH - Key offerings •163.METZ CONNECT GmbH - Key customers •164.METZ CONNECT GmbH - Segment focus •166.Rosenberger Hochfrequenztechnik GmbH & Co. KG - Overview •167.Rosenberger Hochfrequenztechnik GmbH & Co. KG - Product and service •168.Rosenberger Hochfrequenztechnik GmbH & Co. KG - Key offerings •169.Rosenberger Hochfrequenztechnik GmbH & Co. KG - Key customers •170.Rosenberger Hochfrequenztechnik GmbH & Co. KG - Segment focus •172.TE Connectivity Ltd. - Overview •173.TE Connectivity Ltd. - Business segments •174.TE Connectivity Ltd. - Key offerings •175.TE Connectivity Ltd. - Key customers •176.TE Connectivity Ltd. - Segment focus •178.Yazaki Corp. - Overview •179.Yazaki Corp. - Product and service •180.Yazaki Corp. - Key offerings •181.Yazaki Corp. - Key customers •182.Yazaki Corp. - Segment focus •184.Currency conversion rates for US$ •185.Research Methodology •186.Validation techniques employed for market sizing •187.Information sources •188.List of abbreviations

3M Co., ABB Ltd., Amphenol Corp., Aptiv Plc, Foxconn Interconnect Technology Ltd., Huawei Technologies Co. Ltd, METZ CONNECT GmbH, Rosenberger Hochfrequenztechnik GmbH & Co. KG, TE Connectivity Ltd., Yazaki Corp.