2023-2031 Report on Global SiC Power Modules Market by Player, Region, Type, Application and Sales Channel

SKU ID :MAR-23959507 | Published Date: 05-Jun-2023 | No. of pages: 107
This report studies the SiC Power Modules market, covering market size for segment by type (MOSFET Devices and Modules, Diode Devices, etc.), by application (Automobile, Industrial Use, etc.), by sales channel (Direct Channel, Distribution Channel), by player (Infineon Technologies, Mitsubishi Electric, ON Semiconductor, ROHM Semiconductor, STMicroelectronics, etc.) and by region (North America, Europe, Asia-Pacific, South America and Middle East & Africa).

This report provides detailed historical analysis of global market for SiC Power Modules from 2017-2022, and provides extensive market forecasts from 2023-2031 by region/country and subsectors. It covers the sales/revenue/value, gross margin, historical growth and future perspectives in the SiC Power Modules market.

The research methodology used to estimate and forecast this market begins by capturing the revenues of the key players and their shares in the market. Various secondary sources such as press releases, annual reports, non-profit organizations, industry associations, governmental agencies and customs data, have been used to identify and collect information useful for this extensive commercial study of the market. Calculations based on this led to the overall market size. After arriving at the overall market size, the total market has been split into several segments and subsegments, which have then been verified through primary research by conducting extensive interviews with industry experts such as CEOs, VPs, directors, and executives. The data triangulation and market breakdown procedures have been employed to complete the overall market engineering process and arrive at the exact statistics for all segments and subsegments.

Leading players of SiC Power Modules including:
Infineon Technologies
Mitsubishi Electric
ON Semiconductor
ROHM Semiconductor
STMicroelectronics
Toshiba
Microchip Technology
General Electric
Power Integrations
Fairchild Semiconductor
NXP Semiconductors
Tokyo Electron Limited
Renesas Electronics Corporation
GeneSiC Semiconductor

Market split by Type, can be divided into:
MOSFET Devices and Modules
Diode Devices
Others

Market split by Application, can be divided into:
Automobile
Industrial Use
Photovoltaic Industry
Others

Market split by Sales Channel, can be divided into:
Direct Channel
Distribution Channel

Market segment by Region/Country including:
North America (United States, Canada and Mexico)
Europe (Germany, UK, France, Italy, Russia and Spain etc.)
Asia-Pacific (China, Japan, Korea, India, Australia and Southeast Asia etc.)
South America (Brazil, Argentina and Colombia etc.)
Middle East & Africa (South Africa, UAE and Saudi Arabia etc.)

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